Semiconductor Packaging Materials Industry Research Report 2023

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Base Year
2023
Forecast Period
2024-2029
Pages
113
Industry
Packaging
Regions
Global
Updated
December 2025

Report Overview

This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging Materials.
The Semiconductor Packaging Materials market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor Packaging Materials market comprehensively. Regional market sizes, concerning products by types, by application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging Materials companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Key Companies & Market Share Insights
In this section, the readers will gain an understanding of the key players competing. This report has studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue by companies for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo
Product Type Insights
Global markets are presented by Semiconductor Packaging Materials type, along with growth forecasts through 2029. Estimates on revenue are based on the price in the supply chain at which the Semiconductor Packaging Materials are procured by the companies.
This report has studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows revenue data by type, and during the historical period (2018-2023) and forecast period (2024-2029).
Semiconductor Packaging Materials segment by Type
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Application Insights
This report has provided the market size (revenue data) by application, during the historical period (2018-2023) and forecast period (2024-2029).
This report also outlines the market trends of each segment and consumer behaviors impacting the Semiconductor Packaging Materials market and what implications these may have on the industrys future. This report can help to understand the relevant market and consumer trends that are driving the Semiconductor Packaging Materials market.
Semiconductor Packaging Materials Segment by Application
Consume Electrons
Automobiles
Others
Regional Outlook
This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue data of each region and country for the period 2018-2029.
The market has been segmented into various major geographies, including North America, Europe, Asia-Pacific, South America, Middle East & Africa. Detailed analysis of major countries such as the USA, Germany, the U.K., Italy, France, China, Japan, South Korea, Southeast Asia, and India will be covered within the regional segment. For market estimates, data are going to be provided for 2022 because of the base year, with estimates for 2023 and forecast revenue for 2029.
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Semiconductor Packaging Materials market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Reasons to Buy This Report
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Semiconductor Packaging Materials market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
This report will help stakeholders to understand the global industry status and trends of Semiconductor Packaging Materials and provides them with information on key market drivers, restraints, challenges, and opportunities.
This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
This report stays updated with novel technology integration, features, and the latest developments in the market
This report helps stakeholders to understand the COVID-19 and Russia-Ukraine War Influence on the Semiconductor Packaging Materials industry.
This report helps stakeholders to gain insights into which regions to target globally
This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Semiconductor Packaging Materials.
This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Core Chapters
Chapter 1: Research objectives, research methods, data sources, data cross-validation;
Chapter 2: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 3: Provides the analysis of various market segments product types, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 6: Detailed analysis of Semiconductor Packaging Materials companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 7, 8, 9, 10, 11: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 12: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 13: The main points and conclusions of the report.

Table of Contents

  • 1 Preface
    • 1.1 Scope of Report
    • 1.2 Reasons for Doing This Study
    • 1.3 Research Methodology
    • 1.4 Research Process
    • 1.5 Data Source
      • 1.5.1 Secondary Sources
      • 1.5.2 Primary Sources
  • 2 Market Overview
    • 2.1 Product Definition
    • 2.2 Semiconductor Packaging Materials by Type
      • 2.2.1 Market Value Comparison by Type (2018 VS 2022 VS 2029)
      • 1.2.2 Packaging Substrate
      • 1.2.3 Lead Frame
      • 1.2.4 Bonding Wire
      • 1.2.5 Encapsulating Resin
      • 1.2.6 Ceramic Packaging Material
      • 1.2.7 Chip Bonding Material
    • 2.3 Semiconductor Packaging Materials by Application
      • 2.3.1 Market Value Comparison by Application (2018 VS 2022 VS 2029)
      • 2.3.2 Consume Electrons
      • 2.3.3 Automobiles
      • 2.3.4 Others
    • 2.4 Assumptions and Limitations
  • 3 Semiconductor Packaging Materials Breakdown Data by Type
    • 3.1 Global Semiconductor Packaging Materials Historic Market Size by Type (2018-2023)
    • 3.2 Global Semiconductor Packaging Materials Forecasted Market Size by Type (2023-2028)
  • 4 Semiconductor Packaging Materials Breakdown Data by Application
    • 4.1 Global Semiconductor Packaging Materials Historic Market Size by Application (2018-2023)
    • 4.2 Global Semiconductor Packaging Materials Forecasted Market Size by Application (2018-2023)
  • 5 Global Growth Trends
    • 5.1 Global Semiconductor Packaging Materials Market Perspective (2018-2029)
    • 5.2 Global Semiconductor Packaging Materials Growth Trends by Region
      • 5.2.1 Global Semiconductor Packaging Materials Market Size by Region: 2018 VS 2022 VS 2029
      • 5.2.2 Semiconductor Packaging Materials Historic Market Size by Region (2018-2023)
      • 5.2.3 Semiconductor Packaging Materials Forecasted Market Size by Region (2024-2029)
    • 5.3 Semiconductor Packaging Materials Market Dynamics
      • 5.3.1 Semiconductor Packaging Materials Industry Trends
      • 5.3.2 Semiconductor Packaging Materials Market Drivers
      • 5.3.3 Semiconductor Packaging Materials Market Challenges
      • 5.3.4 Semiconductor Packaging Materials Market Restraints
  • 6 Market Competitive Landscape by Players
    • 6.1 Global Top Semiconductor Packaging Materials Players by Revenue
      • 6.1.1 Global Top Semiconductor Packaging Materials Players by Revenue (2018-2023)
      • 6.1.2 Global Semiconductor Packaging Materials Revenue Market Share by Players (2018-2023)
    • 6.2 Global Semiconductor Packaging Materials Industry Players Ranking, 2021 VS 2022 VS 2023
    • 6.3 Global Key Players of Semiconductor Packaging Materials Head office and Area Served
    • 6.4 Global Semiconductor Packaging Materials Players, Product Type & Application
    • 6.5 Global Semiconductor Packaging Materials Players, Date of Enter into This Industry
    • 6.6 Global Semiconductor Packaging Materials Market CR5 and HHI
    • 6.7 Global Players Mergers & Acquisition
  • 7 North America
    • 7.1 North America Semiconductor Packaging Materials Market Size (2018-2029)
    • 7.2 North America Semiconductor Packaging Materials Market Growth Rate by Country: 2018 VS 2022 VS 2029
    • 7.3 North America Semiconductor Packaging Materials Market Size by Country (2018-2023)
    • 7.4 North America Semiconductor Packaging Materials Market Size by Country (2024-2029)
    • 7.5 United States
    • 7.6 Canada
  • 8 Europe
    • 8.1 Europe Semiconductor Packaging Materials Market Size (2018-2029)
    • 8.2 Europe Semiconductor Packaging Materials Market Growth Rate by Country: 2018 VS 2022 VS 2029
    • 8.3 Europe Semiconductor Packaging Materials Market Size by Country (2018-2023)
    • 8.4 Europe Semiconductor Packaging Materials Market Size by Country (2024-2029)
    • 7.4 Germany
    • 7.5 France
    • 7.6 U.K.
    • 7.7 Italy
    • 7.8 Russia
    • 7.9 Nordic Countries
  • 9 Asia-Pacific
    • 9.1 Asia-Pacific Semiconductor Packaging Materials Market Size (2018-2029)
    • 9.2 Asia-Pacific Semiconductor Packaging Materials Market Growth Rate by Country: 2018 VS 2022 VS 2029
    • 9.3 Asia-Pacific Semiconductor Packaging Materials Market Size by Country (2018-2023)
    • 9.4 Asia-Pacific Semiconductor Packaging Materials Market Size by Country (2024-2029)
    • 8.4 China
    • 8.5 Japan
    • 8.6 South Korea
    • 8.7 Southeast Asia
    • 8.8 India
    • 8.9 Australia
  • 10 Latin America
    • 10.1 Latin America Semiconductor Packaging Materials Market Size (2018-2029)
    • 10.2 Latin America Semiconductor Packaging Materials Market Growth Rate by Country: 2018 VS 2022 VS 2029
    • 10.3 Latin America Semiconductor Packaging Materials Market Size by Country (2018-2023)
    • 10.4 Latin America Semiconductor Packaging Materials Market Size by Country (2024-2029)
    • 9.4 Mexico
    • 9.5 Brazil
  • 11 Middle East & Africa
    • 11.1 Middle East & Africa Semiconductor Packaging Materials Market Size (2018-2029)
    • 11.2 Middle East & Africa Semiconductor Packaging Materials Market Growth Rate by Country: 2018 VS 2022 VS 2029
    • 11.3 Middle East & Africa Semiconductor Packaging Materials Market Size by Country (2018-2023)
    • 11.4 Middle East & Africa Semiconductor Packaging Materials Market Size by Country (2024-2029)
    • 10.4 Turkey
    • 10.5 Saudi Arabia
    • 10.6 UAE
  • 12 Players Profiled
    • 11.1 Kyocera
      • 11.1.1 Kyocera Company Detail
      • 11.1.2 Kyocera Business Overview
      • 11.1.3 Kyocera Semiconductor Packaging Materials Introduction
      • 11.1.4 Kyocera Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.1.5 Kyocera Recent Development
    • 11.2 Shinko
      • 11.2.1 Shinko Company Detail
      • 11.2.2 Shinko Business Overview
      • 11.2.3 Shinko Semiconductor Packaging Materials Introduction
      • 11.2.4 Shinko Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.2.5 Shinko Recent Development
    • 11.3 Ibiden
      • 11.3.1 Ibiden Company Detail
      • 11.3.2 Ibiden Business Overview
      • 11.3.3 Ibiden Semiconductor Packaging Materials Introduction
      • 11.3.4 Ibiden Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.3.5 Ibiden Recent Development
    • 11.4 LG Innotek
      • 11.4.1 LG Innotek Company Detail
      • 11.4.2 LG Innotek Business Overview
      • 11.4.3 LG Innotek Semiconductor Packaging Materials Introduction
      • 11.4.4 LG Innotek Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.4.5 LG Innotek Recent Development
    • 11.5 Unimicron Technology
      • 11.5.1 Unimicron Technology Company Detail
      • 11.5.2 Unimicron Technology Business Overview
      • 11.5.3 Unimicron Technology Semiconductor Packaging Materials Introduction
      • 11.5.4 Unimicron Technology Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.5.5 Unimicron Technology Recent Development
    • 11.6 ZhenDing Tech
      • 11.6.1 ZhenDing Tech Company Detail
      • 11.6.2 ZhenDing Tech Business Overview
      • 11.6.3 ZhenDing Tech Semiconductor Packaging Materials Introduction
      • 11.6.4 ZhenDing Tech Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.6.5 ZhenDing Tech Recent Development
    • 11.7 Semco
      • 11.7.1 Semco Company Detail
      • 11.7.2 Semco Business Overview
      • 11.7.3 Semco Semiconductor Packaging Materials Introduction
      • 11.7.4 Semco Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.7.5 Semco Recent Development
    • 11.8 KINSUS INTERCONNECT TECHNOLOGY
      • 11.8.1 KINSUS INTERCONNECT TECHNOLOGY Company Detail
      • 11.8.2 KINSUS INTERCONNECT TECHNOLOGY Business Overview
      • 11.8.3 KINSUS INTERCONNECT TECHNOLOGY Semiconductor Packaging Materials Introduction
      • 11.8.4 KINSUS INTERCONNECT TECHNOLOGY Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.8.5 KINSUS INTERCONNECT TECHNOLOGY Recent Development
    • 11.9 Nan Ya PCB
      • 11.9.1 Nan Ya PCB Company Detail
      • 11.9.2 Nan Ya PCB Business Overview
      • 11.9.3 Nan Ya PCB Semiconductor Packaging Materials Introduction
      • 11.9.4 Nan Ya PCB Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.9.5 Nan Ya PCB Recent Development
    • 11.10 Nippon Micrometal Corporation
      • 11.10.1 Nippon Micrometal Corporation Company Detail
      • 11.10.2 Nippon Micrometal Corporation Business Overview
      • 11.10.3 Nippon Micrometal Corporation Semiconductor Packaging Materials Introduction
      • 11.10.4 Nippon Micrometal Corporation Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.10.5 Nippon Micrometal Corporation Recent Development
    • 11.11 Simmtech
      • 11.11.1 Simmtech Company Detail
      • 11.11.2 Simmtech Business Overview
      • 11.11.3 Simmtech Semiconductor Packaging Materials Introduction
      • 11.11.4 Simmtech Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.11.5 Simmtech Recent Development
    • 11.12 Mitsui High-tec, Inc.
      • 11.12.1 Mitsui High-tec, Inc. Company Detail
      • 11.12.2 Mitsui High-tec, Inc. Business Overview
      • 11.12.3 Mitsui High-tec, Inc. Semiconductor Packaging Materials Introduction
      • 11.12.4 Mitsui High-tec, Inc. Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.12.5 Mitsui High-tec, Inc. Recent Development
    • 11.13 HAESUNG
      • 11.13.1 HAESUNG Company Detail
      • 11.13.2 HAESUNG Business Overview
      • 11.13.3 HAESUNG Semiconductor Packaging Materials Introduction
      • 11.13.4 HAESUNG Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.13.5 HAESUNG Recent Development
    • 11.14 Shin-Etsu
      • 11.14.1 Shin-Etsu Company Detail
      • 11.14.2 Shin-Etsu Business Overview
      • 11.14.3 Shin-Etsu Semiconductor Packaging Materials Introduction
      • 11.14.4 Shin-Etsu Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.14.5 Shin-Etsu Recent Development
    • 11.15 Heraeus
      • 11.15.1 Heraeus Company Detail
      • 11.15.2 Heraeus Business Overview
      • 11.15.3 Heraeus Semiconductor Packaging Materials Introduction
      • 11.15.4 Heraeus Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.15.5 Heraeus Recent Development
    • 11.16 AAMI
      • 11.16.1 AAMI Company Detail
      • 11.16.2 AAMI Business Overview
      • 11.16.3 AAMI Semiconductor Packaging Materials Introduction
      • 11.16.4 AAMI Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.16.5 AAMI Recent Development
    • 11.17 Henkel
      • 11.17.1 Henkel Company Detail
      • 11.17.2 Henkel Business Overview
      • 11.17.3 Henkel Semiconductor Packaging Materials Introduction
      • 11.17.4 Henkel Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.17.5 Henkel Recent Development
    • 11.18 Shennan Circuits
      • 11.18.1 Shennan Circuits Company Detail
      • 11.18.2 Shennan Circuits Business Overview
      • 11.18.3 Shennan Circuits Semiconductor Packaging Materials Introduction
      • 11.18.4 Shennan Circuits Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.18.5 Shennan Circuits Recent Development
    • 11.19 Kangqiang Electronics
      • 11.19.1 Kangqiang Electronics Company Detail
      • 11.19.2 Kangqiang Electronics Business Overview
      • 11.19.3 Kangqiang Electronics Semiconductor Packaging Materials Introduction
      • 11.19.4 Kangqiang Electronics Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.19.5 Kangqiang Electronics Recent Development
    • 11.20 LG Chem
      • 11.20.1 LG Chem Company Detail
      • 11.20.2 LG Chem Business Overview
      • 11.20.3 LG Chem Semiconductor Packaging Materials Introduction
      • 11.20.4 LG Chem Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.20.5 LG Chem Recent Development
    • 11.21 NGK/NTK
      • 11.21.1 NGK/NTK Company Detail
      • 11.21.2 NGK/NTK Business Overview
      • 11.21.3 NGK/NTK Semiconductor Packaging Materials Introduction
      • 11.21.4 NGK/NTK Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.21.5 NGK/NTK Recent Development
    • 11.22 MK Electron
      • 11.22.1 MK Electron Company Detail
      • 11.22.2 MK Electron Business Overview
      • 11.22.3 MK Electron Semiconductor Packaging Materials Introduction
      • 11.22.4 MK Electron Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.22.5 MK Electron Recent Development
    • 11.23 Toppan Printing Co., Ltd.
      • 11.23.1 Toppan Printing Co., Ltd. Company Detail
      • 11.23.2 Toppan Printing Co., Ltd. Business Overview
      • 11.23.3 Toppan Printing Co., Ltd. Semiconductor Packaging Materials Introduction
      • 11.23.4 Toppan Printing Co., Ltd. Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.23.5 Toppan Printing Co., Ltd. Recent Development
    • 11.24 Tanaka
      • 11.24.1 Tanaka Company Detail
      • 11.24.2 Tanaka Business Overview
      • 11.24.3 Tanaka Semiconductor Packaging Materials Introduction
      • 11.24.4 Tanaka Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.24.5 Tanaka Recent Development
    • 11.25 MARUWA
      • 11.25.1 MARUWA Company Detail
      • 11.25.2 MARUWA Business Overview
      • 11.25.3 MARUWA Semiconductor Packaging Materials Introduction
      • 11.25.4 MARUWA Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.25.5 MARUWA Recent Development
    • 11.26 Momentive
      • 11.26.1 Momentive Company Detail
      • 11.26.2 Momentive Business Overview
      • 11.26.3 Momentive Semiconductor Packaging Materials Introduction
      • 11.26.4 Momentive Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.26.5 Momentive Recent Development
    • 11.27 SCHOTT
      • 11.27.1 SCHOTT Company Detail
      • 11.27.2 SCHOTT Business Overview
      • 11.27.3 SCHOTT Semiconductor Packaging Materials Introduction
      • 11.27.4 SCHOTT Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.27.5 SCHOTT Recent Development
    • 11.28 Element Solutions
      • 11.28.1 Element Solutions Company Detail
      • 11.28.2 Element Solutions Business Overview
      • 11.28.3 Element Solutions Semiconductor Packaging Materials Introduction
      • 11.28.4 Element Solutions Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.28.5 Element Solutions Recent Development
    • 11.29 Hitachi Chemical
      • 11.29.1 Hitachi Chemical Company Detail
      • 11.29.2 Hitachi Chemical Business Overview
      • 11.29.3 Hitachi Chemical Semiconductor Packaging Materials Introduction
      • 11.29.4 Hitachi Chemical Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.29.5 Hitachi Chemical Recent Development
    • 11.30 Fastprint
      • 11.30.1 Fastprint Company Detail
      • 11.30.2 Fastprint Business Overview
      • 11.30.3 Fastprint Semiconductor Packaging Materials Introduction
      • 11.30.4 Fastprint Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.30.5 Fastprint Recent Development
    • 11.31 Hongchang Electronic
      • 11.31.1 Hongchang Electronic Company Detail
      • 11.31.2 Hongchang Electronic Business Overview
      • 11.31.3 Hongchang Electronic Semiconductor Packaging Materials Introduction
      • 11.31.4 Hongchang Electronic Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.31.5 Hongchang Electronic Recent Development
    • 11.32 Sumitomo
      • 11.32.1 Sumitomo Company Detail
      • 11.32.2 Sumitomo Business Overview
      • 11.32.3 Sumitomo Semiconductor Packaging Materials Introduction
      • 11.32.4 Sumitomo Revenue in Semiconductor Packaging Materials Business (2017-2022)
      • 11.32.5 Sumitomo Recent Development
  • 13 Report Conclusion
  • 14 Disclaimer

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